Committees


The 21st IAPRI World Conference on Packaging


Chair:


Prof. Zhi-Wei Wang, Assistant President, Jinan University


Co-Chair:


Prof. Changfan Zhang, Vice President, Hunan University of Technology

Prof. Jay Singh, IAPRI President, Cal Poly State University



ORGANZING COMMITTEE


Members:

Edward A. Church, IAPRI

Wencai Xu, Beijing Institute of Graphic Communication

Lixin Lu, Jiangnan University 

Xinguang Lv, Jinan University

Qishui Yao, Hunan University of Technology

Yuejun Liu, Hunan University of Technology

Zhihui Sun, Harbin University of Commerce

De Gao, Zhejiang University Ningbo Institute of Technology

Houbin Li, Wuhan University

Jinzhou Chen, Zhengzhou University

Yunzhi Chen, Tianjin University of Science and Technology

Guanglian Li, RecyclingTimes Group

Dongmei Huang, SZJJ


Secretary:

Jianwei Yan, Jinan University

Zhaoxia Dai, Hunan University of Technology

Shiu Cheung Ho, RecyclingTimes Group

Xueyan Liang, RecyclingTimes Group

Kun Chen, Jinan University

Yuanbiao Zhang, Jinan University




INTERNATIONAL SCIENTIFIC COMMITTEE


Alexander Bardenshtein, Danish Technological Institute, Denmark

Gregory Batt, Clemson University, NC, USA

Wannee Chinsirikul, National Metal and Materials Technology Center, Thailand

Vanee Chonhenchob, Kasetsart University, Thailand

Edward A. Church, IAPRI, CPPL, USA

Silvia Tondella Dantas, CETEA, Brazil

Andrew East, Massey University, New Zealand

Changqing Fang, Xian University of Technology, China

Javier de la Fuente, California Polytechnic State University, USA

Maria Jose Galotto, Univeristy of Santiago de Chile, Chile

Rafael Gavara, IATA-CSIC, Spain

Changfeng Ge, Rochester Institute of Technology (RIT), USA

Thomas Goedecke, Federal Institute for Materials Testing (BAM), Germany

Cristina Guzman-Siller, Universidad de Monterrey, Mexico

Chang-Ying Hu, Jinan University, China

Chongxing Huang, Guangxi University, China

Tunyarut Jinkarn, Kasetsart University, Thailand

Dong Sun Lee, Kyungnam University, South Korea

Qin-Bao Lin, Jinan University, China

Yuejun Liu, Hunan University of Technology, China

Binglin Lu, China Packaging Research & Test Center, China

Cristina Nerin, University of Zaragoza, Spain

Annika Olsson, Lund University, Sweden

Luciano Piergiovanni, Universita di Milano, Italy

Jing Qian, Jiangnan University, China

Vincent Rouillard, Victoria University, Australia

Katsuhiko Saito, Kobe University, Japan

Susan Selke, Michigan State University, USA

David Shires, Wiley Journal of Packaging Technology and Science, UK

Jay Singh, Cal Poly State University, USA

Lih-Sheng Turng, University of Wisconsin – Madison, USA

Karli Verghese, RMIT University, Australia

Dongmei Wang, Shenzhen Polytechnic, China

Jun Wang, Jiangnan University, China

Zhi-Wei Wang, Jinan University, China

Frank Welle, Fraunhofer Institute for Process Engineering and Packaging, Germany

Renee Wever, Linkoping University, Sweden

Yves Wyser, Nestle Research Centre, Switzerland

Kit L. Yam, Rutgers State University, USA

Selcuk Yildirim, ZHAW – Zurich University of Applied Sciences, Switzerland